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    ZHOU Tianchi, DING Jiangtao, LAI Yongbiao, SUN Hang, GUO Pingyi. High Temperature Oxidation Behavior and Conductivity of Prepared Mn-Cu spinel Coating for Metal Interconnects[J]. Corrosion & Protection, 2020, 41(1): 9-13. DOI: 10.11973/fsyfh-202001002
    Citation: ZHOU Tianchi, DING Jiangtao, LAI Yongbiao, SUN Hang, GUO Pingyi. High Temperature Oxidation Behavior and Conductivity of Prepared Mn-Cu spinel Coating for Metal Interconnects[J]. Corrosion & Protection, 2020, 41(1): 9-13. DOI: 10.11973/fsyfh-202001002

    High Temperature Oxidation Behavior and Conductivity of Prepared Mn-Cu spinel Coating for Metal Interconnects

    • In order to prevent the external diffusion of Cr and improve the high temperature performance of metal joints, Cu-Mn spinel was prepared on 430SS substrate by high energy microarc alloying (HEMAA) process using Mn-35Cu (atomic fraction%) alloy electrode, and then, in situ oxidization in air at 750℃ was used to obtain a Cu-Mn composite spinel coating. The results showed that Cu-Mn composite spinel coating wass dense and had good adhesion. In addition to Cu-Mn spinel oxide, the main component of the coating also contained a certain amount of Mn2O3, and the content of Cr and Fe in the oxide layer was low. The area specific resistance test of the coating at 800℃ showed that the resistance of the composite Cu-Mn spinel coating obtained after oxidation for 100 h was 10 mΩ·cm2. The composite Cu-Mn spinel coating after in-situ oxidation of high energy micro-arc alloy was a promising metal linker coating.
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