Corrosion Behavior of Submarine Cable Copper Clad Layer in Seawater Simulation Solution in Zhoushan

The corrosion behavior of oxygen-free copper in the submarine cable armoring layer in seawater service environment was studied. The effects of Cl^-, SO₄^2- and HCO₃^- on the corrosion behavior of the copper armor layer were studied by electrochemical test technology, immersion test, scanning electron microscopy (SEM) and X-ray diffraction (XRD). The results show that among these anions, Cl^- was the most corrosive to copper. The order of influence of the three anions on the corrosion of copper armor was: Cl^- > SO₄^2- > HCO₃^-. The corrosion rate of copper increased with the increase of temperature. Copper hardly corroded in normal temperature HCO₃^- solution. At 38 ℃, the copper surface corroded to some extent, but the corrosion rate was low.