Corrosion Behavior of Submarine Cable Copper Clad Layer in Seawater Simulation Solution in Zhoushan

HU Jiayuan; QIAN Zhouhai; ZHANG Di; WANG Zhu; ZHANG Lei

doi:10.11973/fsyfh-202005004

Corrosion & Protection > 2020 > 41(5): 16-21. > DOI: 10.11973/fsyfh-202005004

HU Jiayuan, QIAN Zhouhai, ZHANG Di, WANG Zhu, ZHANG Lei. Corrosion Behavior of Submarine Cable Copper Clad Layer in Seawater Simulation Solution in Zhoushan[J]. Corrosion & Protection, 2020, 41(5): 16-21. DOI: 10.11973/fsyfh-202005004

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Corrosion Behavior of Submarine Cable Copper Clad Layer in Seawater Simulation Solution in Zhoushan

1. State Grid Zhejiang Electric Power Research Institute, Hangzhou 310014, China;
2. University of Science and Technology Beijing, Beijing 100083, China

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Received Date: October 11, 2018

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The corrosion behavior of oxygen-free copper in the submarine cable armoring layer in seawater service environment was studied. The effects of Cl^-, SO₄^2- and HCO₃^- on the corrosion behavior of the copper armor layer were studied by electrochemical test technology, immersion test, scanning electron microscopy (SEM) and X-ray diffraction (XRD). The results show that among these anions, Cl^- was the most corrosive to copper. The order of influence of the three anions on the corrosion of copper armor was: Cl^- > SO₄^2- > HCO₃^-. The corrosion rate of copper increased with the increase of temperature. Copper hardly corroded in normal temperature HCO₃^- solution. At 38 ℃, the copper surface corroded to some extent, but the corrosion rate was low.
- armored oxygen-free copper wire,
- corrosion,
- polarization curve

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