Corrosion Effect of Organic Acidic Pollutants on Copper Materials

The corrosion behavior of pure copper in simulated corrosive solution containing formic acid or acetic acid was studied by thin-film electrochemical method, and the corrosion products on the surface of samples after simulated exposure test were characterized by SEM-EDS and XRD. The results showed that when the liquid film thickness was about 100 μm, the corrosion rate of copper increased with the increase of the concentration of formic acid or acetic acid; when the concentrations of formic acid and acetic acid were the same, formic acid had a relatively more serious effect on the corrosion of copper. The final corrosion products of copper in two organic acid environments were mainly cuprous oxide, copper formate crystals and copper acetate crystals.