Preparation of Electroplated Copper Coatings on Znic Substrate Standard Plate for Coulometric Coating Thickness Tester

To solve the problems of the electroplating coat adhesion and traceability of electroplated copper coating on Zinc substrate standard film for coulometric coating thickness tester, the process of preimpregnation activation alkaline copper plating is applied to substitute for the process of cyanide copper plating. This substitution can solve the contradiction between environment protection and plating coat adhesion of standard film. An independently designed electroplating cell is used to obtain copper plating with incompletely coated cast and uniform thickness, meeting the requirements of copper coating on zinc substrate standard film for coulometric coating thickness tester.