Aging Behavior of Epoxy Molding Compound for Electronic Components in Hydrothermal Environment

In order to analyze the failure problems of the epoxy molding compound(EMC)used for electronic components during application process,the aging behavior of EMC under drying and hydrothermal conditions (relative humidity 95% and 98%) at 60 ℃ was studied.The relationship between aging time and the properties,such as the quality,hardness,mechanical properties and structure of EMC were also discussed.The results show that the aging process of EMC would be accelerated under drying and hydrothermal conditions.The quality,hardness and bending strength of EMC changed with its structure.With increasing the aging time in different conditions,the relative hardness increased from 5.62 to 12.01 in the hydrothermal condition (98% relative humidity).The weight-loss ratio was enhanced from 0.008% to 0.172% in the dry condition,while in the hydrothermal condition it was almost stable.The bending strength increased linearly with time in the dry condition,and increased at first then declined in the hydrothermal condition.