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    NIE Xin-hui, ZHENG Min-cong, LI Jian-hua. Electrochemical Corrosion Behavior of Copper Grounding Grid Material[J]. Corrosion & Protection, 2012, 33(9): 817-819.
    Citation: NIE Xin-hui, ZHENG Min-cong, LI Jian-hua. Electrochemical Corrosion Behavior of Copper Grounding Grid Material[J]. Corrosion & Protection, 2012, 33(9): 817-819.

    Electrochemical Corrosion Behavior of Copper Grounding Grid Material

    • Electrochemical tests of copper grounding grid material were carried out in eight 500 kV substations in Anhui province, using the electrolyte of water∶soil=1∶1. The polarization curves indicated that the corrosion rate of copper grounding grid material was mainly affected by the rate of electron diffusion, not by oxygen diffusion. The electrochemical impedance spectroscopy of copper material showed that, after immersion in the electrolyte of water∶soil=1∶1 for 4 hours, the corrosion rate of copper grounding grid material was only affected by the dissolution rate of the working electrode.
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