A NEW TECHNOLOGY OF NONMETALLIC ELECTROLESS COPPER PLATING

A completely new technology of electroless copper plating in the redesigned nonmetallic electroless copper plating solution was developed.The influence of various factors on the depositing speed and stability of the solution was studied.Using hypophosphite as reducing agent replacing formaldehyde and mixed active Cu2+ and Ni2+ as catalyst,the new technology has excellent performonce such as high speed,no toxin,compact and lucent plating,steady solution,is superior to the common copper plating technology.